Micron
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US Commerce Secretary calls for CHIPS Act 2
By Anton Shilov published
$39 billion in grands and $75 billion in loans and loan guarantees apparently not enough to rebuild the U.S. industry.

Intel's CHIPS Act award package exceeds $10 billion, payout expected within two weeks: Report
By Anton Shilov published
Intel is in talks with the U.S. government over a $10+ billion subsidies + loans package.

SK Hynix says new high bandwidth memory for GPUs on track for 2024 - HBM4 with 2048-bit interface and 1.5TB/s per stack is on the way
By Anton Shilov published
HBM4 memory with a 2048-bit interface on track for production in 2026.

Chip price war unfolds as Chinese foundries cut tape-out prices
By Anton Shilov published
Chinese foundries yet have to build additional capacity in the coming years, but they are already cutting down tape-out prices.

Micron displays next-gen LPCAMM2 modules for laptops at CES 2024
By Anton Shilov published
Micron showcases next-generation memory LPCAMM2 modules for laptops and small form-factor desktops.

Micron unveils LPCAMM2 - bringing LPDDR5X to smaller form factor memory modules
By Anton Shilov published
Micron puts LPDDR5X memory into LPCAMM2 modules to reduce power consumption and increase the performance of modern laptops.

Semiconductor industry proposes new 'Chipmaker's Visa' for H1B program
By Anton Shilov last updated
American semiconductor industry needs tens of thousands of foreign workers, so the government has to alter H1-B visa program, U.S. chipmakers believe.

China to lead semiconductor industry expansion with 18 new fabs in 2024
By Anton Shilov published
The SEMI World Fab Forecast report predicts that China will lead the global semiconductor industry expansion in 2024.
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