Latest about TSMC
But China's 3nm remains years away.
The rush to build semiconductor plants in the U.S. is fueling the demand for engineers and technicians.
OpenAI deepens chip cooperation with Samsung, possibly prepares to Double source AI ASICs from two foundries in a bid to get more in-house silicon to its data centers.
Premium ASML, Intel, Samsung, and TSMC back development of 6×12-inch to build large processors using High-NA EUV lithography systems without stitching.
TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.
TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
