TSMC
Latest about TSMC

Taiwan considers TSMC export ban that would prevent manufacturing its newest chip nodes in U.S.
By Anton Shilov published
Taiwan's government is considering imposing N+2 export rule on TSMC's advanced process technologies, which would make it significantly harder for the foundry to develop overseas.

TSMC brings its most advanced chipmaking node to the US yet, to begin equipment installation for 3nm months ahead of schedule
By Anton Shilov published
Fab 21 phase 2 shell is complete, fab is on track for equipment move in in mid-2026 and for volume production in 2027.

Sales of chip production equipment to reach $156 billion by 2027 due to AI and DRAM demand
By Anton Shilov published
Driven by demand for AI and HPC accelerators, sales of chip production equipment are projected to increase through 2027. Asian countries are expected to lead the pack, according to SEMI.

The data center cooling state of play (2025) — Liquid cooling is on the rise as thermal density demands skyrocket in AI data centers
By Anton Shilov published
Premium From the air outside to de-ionized water inside.

TSMC ponders upgrading 2nd Japan fab to 4nm
By Anton Shilov last updated
TSMC reportedly mulls making 4nm chips in Japan amid putting construction of Fab 23 phase 2 on pause.

TSMC could be inching closer to making 'all American' chips
By Anton Shilov published
TSMC may be accelerating its advanced packaging facility in Arizona to package the first processors as early as 2028, ahead of its partner Amkor.

TSMC claims 4.2X efficiency gain over a decade from N7 to A14 fabrication process
By Anton Shilov published
TSMC clarifies A14 specifications: Even more performance, but better tools might be needed to extract the full potential of the latest process technologies.

HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E
By Anton Shilov published
Premium HBM memory evolves with demand.

Taiwan hits Japanese firm with indictment in TSMC data theft saga
By Jon Martindale published
As chip companies become important to national security, trade thefts have an entirely new gravity to them.

Industry's first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device
By Anton Shilov published
Alchip and Ayar Labs team up to build optical connectivity solution based on TSMC's COUPE framework that lets fabless chip designers to easily add optical connectivity to their designs.
Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.