Latest about TSMC
Nintendo Switch 2's SoC die shot reveals 8x A78C cores, 1,536 Ampere shaders, and Samsung's 8N process
Geekerwan managed to procure a non-functional Nintendo Switch 2 board, and utilized a FIB-SEM to dissect and analyze its internal details.
Ampere sneaks out a 192-core CPU with 12-channel DDR5 memory
Ampere expands lineup of AmpereOne CPUs with AmpereOne M processors featuring a 12-channel DDR5 memory subsystem that can address 3TB of DRAM.
10% surge in Taiwanese currency vs US dollar could hurt PC and components pricing
The currency of Taiwan, the 'silicon island,' has appreciated over 10% vs the USD in the space of just a few days, raising concerns about further price rises coming to U.S. consumers.
Apple expects to source over 19 billion chips from U.S. factories this year
Apple plans to source over 19 billion chips from U.S. facilities in 2025 — including tens of millions from TSMC’s Arizona fab — while investing $500 billion to expand its American operations.
Intel hedges its bet for High-NA EUV with the 14A process node
Intel has not yet fully committed to using the new High-NA EUV chipmaking tool in production and has an alternative production flow of its 14A node that uses standard Low-NA EUV as a backup plan.
Russia's Baikal has produced 85,000 of its CPUs since 2012, aims for more
Most are low-end Baikal-T chips for embedded applications.
TSMC SVP Kevin Zhang opens up on process technology development & evolving demands: Interview
How 'everyone's foundry' adapts to demand
TSMC starts construction its 1.6nm and 2nm-capable U.S. fab: Fab 21 phase 3
TSMC breaks ground for its third Fab 21 module in the U.S., which will produce chips on A16 and N2 process technologies towards the end of the decade.
