TSMC
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TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov published
TSMC plans to build or ramp up nine new production facilities in 2025 — the highest in its history — as it accelerates global expansion to meet demand and rising manufacturing complexity.

GlobalWafers to invest a further $4 billion into U.S. chip manufacturing
By Ash Hill published
Taiwanese manufacturer GlobalWafers is planning to invest $4 billion more into US-based chip manufacturing after opening a new facility in Sherman, Texas.

Trump tells Apple CEO Tim Cook 'I don't want you building in India,'
By Stephen Warwick published
President Trump says he told Apple CEO Tim Cook to stop building plants in India and make devices in the U.S. instead.

U.S. issues worldwide crackdown on using Huawei Ascend chips
By Anton Shilov published
While scrapping the AI Diffusion Rule, the U.S. government has banned Huawei's Ascend AI processors as they allegedly use American technologies without authorization.

Intel says foundry business won't break even until 14A in 2027
By Anton Shilov published
Intel expects its loss-making Foundry division to reach breakeven by 2027, driven by internal adoption of its 18A process, and contributions from packaging, and mature nodes.

Former chairman of China's chipmaking champion gets suspended death sentence in corruption and embezzlement case
By Stephen Warwick published
Zhao Weiguo has been given a suspended death sentence.

Intel vs AMD: Which CPUs Are Better in 2025?
By Paul Alcorn last updated
We wade into the endless debate: Who makes the best CPU, AMD or Intel? Here's the blow-by-blow in ten categories.

Nvidia reportedly raises GPU prices by 10-15% as manufacturing costs surge
By Stephen Warwick published
A new report claims Nvidia has raised the prices of its GPUs to combat rising manufacturing costs and tariff increases.

Lenovo's in-house Arm chip could rival Qualcomm and MediaTek, spotted in Yoga Pad Pro 2-in-1 convertible
By Hassam Nasir published
Lenovo is reportedly working on a custom in-house SoC for its Yoga Pad Pro family, rumored to be built on TSMC's 5nm process.

Former SK hynix employee transferred advanced chip packaging technologies to Huawei
By Anton Shilov published
A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at Huawei’s HiSilicon, raising alarm over tech IP leaks to China.
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