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SK hynix to spend $90 billion to build 'world's largest mega fab complex' — first fab operational in 2027
By Matthew Connatser published
Termed the Yongin Semiconductor Cluster, SK hynix's upcoming quadruple fab complex will be the largest in the world.
Ultra Ethernet Consortium adds 45 new members in five months – aiming for version 1.0 to connect HPC and AI clusters this year
By Anton Shilov published
45 additional members join the Ultra Ethernet Consortium to enable next-generation connectivity for AI and HPC applications.
Intel pushes launch date of Ohio fab from 2025 to 2027 or 2028
By Mark Tyson published
Intel reports that its Ohio fab won't be operational until 3 years later than originally reported.
U.S. outlines five-year plan to harness CHIPS Act funds
By Matthew Connatser published
The National Science and Technology Council has published its five-year strategy to make the most of the CHIPS Act.
ASML delivers cutting-edge new chipmaking tool
By Anton Shilov published
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
Chinese foundry XMC aims to produce HBM memory
By Anton Shilov published
Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.
Samsung races to beat Intel to market with glass substrates for chips — revolutionary tech boosts processing capabilities
By Anton Shilov published
Intel forms strategic alliance to develop and commercialize usage of glass substrates.
Pentagon pulls out of Intel's $3.5 billion CHIPS Act grant, expects Commerce Department to foot the bill
By Christopher Harper published
The Pentagon pulled out of a plan to give Intel more CHIPS Act funding.
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