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Pentagon now considers China's 3D NAND maker YMTC a 'military company'
By Anton Shilov published
Pentagon believes that Yangtze Memory could be supporting China's military complex.
Intel's Ohio fabs could reportedly slip to late 2026 — 'Silicon Heartland' factories were originally planned for 2025
By Anton Shilov published
Intel reportedly delays $20 billion Ohio fab project due to govt incentives and chip demand.
SK Hynix to build HBM fab in Indiana
By Roshan Ashraf Shaikh published
Once this fab plant commences operation, it will make HBM for Nvidia AI GPUs made and packaged by TSMC's plant in Arizona
Qualcomm earnings call suggests Apple will again extend 5G modem license, to 2027
By Roshan Ashraf Shaikh published
Due to several setbacks in its original plans to introduce its own modem SoC, Apple decided to extend its agreement with Qualcomm, extending its current patent license agreement until 2027.
The U.S. government will distribute $500 million from the CHIPS Act to fund R&D for packaging technology and a research institute
By Matthew Connatser published
The Department of Commerce is signaling that it intends to distribute at least $500 million of CHIPS Act cash.
ASML fires back at accusations that its next-gen High-NA EUV chipmaking tools are too expensive
By Anton Shilov published
ASML asserts that its next-generation High-NA EUV tools have numerous advantages over existing Low-NA tools.
Chip smuggling operation that sent 53,000 banned American chips to China gets busted
By Matthew Connatser published
A smuggling operation carried out by the unnamed South Korean 'Company A' involved 53,000 chips worth nearly $12 million.
Chinese silicon wafer makers to increase capacity to satisfy domestic chip boom: report
By Anton Shilov published
In wake of looming chip production capacity increase, Chinese wafer makers ramping up their capacity too.
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