Latest about Manufacturing
Premium Lumentum CEO Michael Hurlston told an audience at the RAISE Summit that indium phosphide is heading into a squeeze worse than the one in memory.
Premium Aishengna has been named by a single source who declined to be named, and its shareholders, SMEE, and Yuliangsheng didn’t respond to requests for comment.
A state-backed company in Shanghai has begun mass-producing immersion deep ultraviolet lithography machines and is due to deliver the first units this year.
Premium TYLsemi is set to offer pre-validated chiplets, along with custom ASIC design services, and build highly custom multi-tile processors at relatively low costs.
Premium Intel will design, package, and fabricate Fortinet's sixth-generation Security Processor (SP6) on its Intel 4 node.
SP6 will draw on what the companies described as Intel's expertise in disaggregated semiconductor design and advanced packaging.
TSMC reportedly intends to increase prices of wafers it processes citing demand, rising costs, and increased investments in new capacity.
SMIC's N+3 process technology can achieve transistor density comparable to TSMC's N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.
