AMD Allegedly Testing Hybrid Processor with Zen 4 and 4c Cores By Anton Shilov published 18 March 23 AMD's Phoenix 2 APU may pack two Zen 4 cores, four Zen 4c cores.
AMD Ryzen 9 7950X3D vs Intel Core i9-13900K Faceoff: Battle of the Gaming Flagships By Paul Alcorn published 18 March 23 We put the AMD Ryzen 9 7950X3D and the Intel Core i9-13900K through a six-round fight to see which chip comes out on top.
AMD Delays 7040HS 'Phoenix' Laptop CPUs to April By Andrew E. Freedman published 17 March 23 AMD's 7040HS "Phoenix" processors are being pushed into April, after originally being announced for March.
Intel Reportedly Cancels Thunder Bay Hybrid SoC By Anton Shilov published 17 March 23 Intel cancels hybrid SoC with Movidius VPU and general-purpose CPU for edge computing.
Best Budget CPUs of 2023, Tested and Ranked By Paul Alcorn published 17 March 23 You can get a surprisingly powerful processor for less than $60. We've tested several cheap budget CPUs to help you find the right one for your needs and budget.
Intel Rumored to Pull-in 2nm Arrow Lake-S Launch to H1 2024 By Anton Shilov published 17 March 23 Report says Intel's Arrow Lake-S may replace Meteor Lake-S in desktops.
Old Bug Makes AMD's 7950X Appear to Run at 6.3 GHz By Zhiye Liu published 16 March 23 A user encounters an RTC bug from the Ryzen 3000 (Zen 2) days that occasionally affect AMD's modern Ryzen 7000 Zen 4 processors.
Intel's Xeon W9-3495X Can Draw 1,900W of Power By Anton Shilov published 16 March 23 Extremely overclocked 56-core Intel Xeon CPU consumes an extreme amount of power.
AMD Shoots Down EPYC Genoa Memory Bug Claims, Says Update On Track By Paul Alcorn published 16 March 23 AMD repudiated a claim that its EPYC Genoa chips suffer from a bug in the memory subsystem that will require a redesign of the processor.
AMD's 6nm Rembrandt, 4nm Phoenix CPUs May Arrive On AM5 By Zhiye Liu published 15 March 23 Leaked information reveals that two more AMD Ryzen processor lineups could be en route to the desktop AM5 socket.
China's Loongson Faces Overwhelming Obstacles Due to U.S. Restrictions By Anton Shilov published 15 March 23 Loongson is facing massive tailwinds due to its recent inclusion on the U.S. Department of Commerce’s Entity list
New US Sanctions Against China's Chip Sector May Set it Back by a Decade By Anton Shilov published 14 March 23 SMIC will have problems making chips using sub-40nm nodes if the U.S. imposes new sanctions against China.
AMD Rolls Out EPYC Embedded 9004 CPUs: Up to 96 Cores By Anton Shilov published 14 March 23 AMD introduces EPYC 9004-series processors for storage, networking, and industrial applications.
Unannounced Zen 4-Based Phoenix Mobile CPU Hits Nearly 5GHz By Aaron Klotz published 14 March 23 Zen 4 makes its way to the low-power mobile sector
The Best CPU for Gaming in 2023 By Paul Alcorn published 12 March 23 Here is the best CPU for gaming for the money, based on our benchmarks. These processors offer the best performance in their price ranges and most are suitable for overclocking.
Ryzen 9 7945HX Games 10% Faster Than Core i9-13950HX, According to AMD Benchmarks By Zhiye Liu published 11 March 23 AMD announces the availability of the Ryzen 7045 (Dragon Range) processor and compares Ryzen 9 7945HX to Intel's latest Core i9-13950HX processor.
AMD's First Official Ryzen 7 7800X3D Gaming Benchmarks vs Core i9-13900K, Up To 24% Faster By Paul Alcorn published 11 March 23 AMD shared the first official gaming benchmarks of its hotly-anticipated Ryzen 7 7800X3D CPUs compared to the Core i9-13900K.
CPU Benchmarks and Hierarchy 2023: Processor Ranking Charts By Paul Alcorn published 11 March 23 All of today's desktop CPU benchmarks compared, including Intel's 13th-Gen Core series and AMD's Ryzen Zen 4 and Threadripper.
AMD Ryzen 9 7900X3D Review: 3D V-Cache's Forgotten Middle Ground By Paul Alcorn published 10 March 23 We put AMD's new gaming-focused $599 12-core Ryzen 9 7900X3D through our full gamut of tests to see if it comes out on top as the best CPU for gaming.
Veteran TSMC R&D Exec Joins Samsung's Chip Packaging Team By Mark Tyson published 10 March 23 An R&D exec who spent nearly two decades at TSMC specializing in advanced chip packaging has joined Samsung to fill a similar role.