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Nvidia rumored to ditch its first-gen custom memory form factor for newer version
By Luke James published
Nvidia has reportedly cancelled its first-gen SOCAMM (System-on-Chip Attached Memory Module) rollout and is shifting development focus to a new version known as SOCAMM2.

TSM-Bee? TSMC gets into the honey business
By Mark Tyson published
TSMC has worked with local beekeepers in Taiwan to produce ‘Ji Mi’ – TSMC branded honey.

Nvidia Rubin CPX forms one half of new, "disaggregated" AI inference architecture
By Sunny Grimm published
Nvidia's "disaggregated" inference strategy will combine HBM-equipped Rubin GPUs with new Rubin CPX chips.

Apple debuts A19 and A19 Pro processors for iPhone 17, iPhone Air, and iPhone 17 Pro
By Andrew E. Freedman, Brandon Hill published
Apple introduced its A19 and A19 Pro processors to power its new line of iPhones, including the iPhone 17, iPhone Air, iPhone 17 Pro, and iPhone 17 Pro Max.

ASML makes $1.5billion investment in Mistral AI
By Anton Shilov published
ASML has invested €1.3 billion in s Mistral AI allegedly in a strategic move to deepen its use of AI across lithography and chipmaking software.

Intel CFO confirms that 14A will be more expensive to use than 18A
By Anton Shilov last updated
Intel's 14A process, designed for both internal and foundry use, will be significantly more expensive than 18A due to its reliance on ASML's $380 million High-NA EUV tools.

U.S. government considers annual permits for Samsung and SK hynix to supply equipment to their Chinese fabs
By Anton Shilov published
What about TSMC?

TSMC increases Arizona internships to feed its Phoenix fabs
By Luke James published
TSMC has more than doubled its Arizona internship program, pulling in over 200 students from around 60 colleges this summer as it races to staff its advanced-node fabs outside Phoenix.
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