Intel

Intel's upcoming Nova Lake desktop processors continue to gather momentum, with fresh reports hinting at Core Ultra Series 400 branding and a phased launch timeline.

Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

Intel to modernize semiconductor production facility in Ireland in a bid to increase output of Xeon 6 and other Xeon products made using Intel 3 fabrication process.

Intel has unveiled Starfire, a space-grade system-on-chip designed for the U.S. government.

Intel readies Xeon 'Dunlow' platform with 28 cores in LGA1954 packaging for entry-level servers and workstations.

Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.

Premium America's AI supply chain now starts and ends in the U.S., while its most valuable middle steps remain entirely offshore until at least 2028.