Latest about Intel
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
David Zinsner, chief financial officer of Intel, boasted at a conference
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
Premium Intel's Wildcat Lake is competing in the budget laptop market, but it takes a very different approach, leveraging a UCIe interconnect and Intel's latest 18A node.
Premium Xe3P focuses on the most compute-intensive phases of AI inference.
AMD has dominated the DIY space so thoroughly over the last few years that an Intel chip appearing in the top 10 at all is notable, but it's not really that surprising if you look at the details.
As Intel boosts output of data center and notebook CPUs, AMD manages to outgrow it and keep capturing market share from its arch-rival.
Intel’s Robert Hallock says he hopes enthusiasts “do the math” compared to AMD, highlighting that the company’s new core architecture will release in consumer processors before the data center.
