Latest about semiconductors
Ahead of possible new U.S. export regulations, Chinese chipmakers increase purchases of semiconductor fab tools.
The U.S. government approves shipments of wafer fab equipment to many Chinese fabs, other are banned. Question is, can those tools be installed in banned fabs?
TSMC takes a page from Intel's IDM 2.0, proclaims itself a Foundry 2.0 company.
U.S. government wants to further restrict curbs for China's semiconductor sector as foreign companies still sell fairly advanced tools to Chinese entities.
1D metals demonstrated in 2D semiconductor circuits.
Following the collapse of a $3 billion IDM project, doubts are growing about the prospects of China's chip industry.
Chinese entities keep getting advanced chipmaking tools made by American companies from South Korean companies.
Russia can now build lithography system capable of making 350nm chips.
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
