Latest about semiconductors
Kioxia launches BiCS9 NAND samples with hybrid design and Toggle 6.0 interface, blending performance with efficiency
A transitional step for manufacturing and performance tuning ahead of BiCS10’s more complex, high-density architecture.
TSMC accelerates U.S. investment at Arizona fab by six months for A16 and N2 production
TSMC's $165 billion U.S. investment gets speed boost
Space Forge to pioneer semiconductor manufacturing in space
Space Forge has secured record Series A funding that will fuel the launch of manufacturing satellites that can make materials impossible to produce on Earth.
Russia bypasses sanctions and obtains spare parts for decades old ASML chip making machines: Report
Russian companies get spare parts for ASML's PAS 5500 lithography steppers from 1990s – 2000s through China-based intermediaries.
Chinese companies spend $26 billion on advanced chipmaking machinery investment
Ahead of possible new U.S. export regulations, Chinese chipmakers increase purchases of semiconductor fab tools.
The U.S. has sanctioned 18 Chinese fabs, dozens remain in white zone
The U.S. government approves shipments of wafer fab equipment to many Chinese fabs, other are banned. Question is, can those tools be installed in banned fabs?
TSMC establishes new Foundry 2.0 paradigm — could help address regulatory concerns of a monopoly
TSMC takes a page from Intel's IDM 2.0, proclaims itself a Foundry 2.0 company.
U.S. planning 'draconian' sanctions against China's semiconductor industry: Report
U.S. government wants to further restrict curbs for China's semiconductor sector as foreign companies still sell fairly advanced tools to Chinese entities.
