semiconductors
Latest about semiconductors
Russia bypasses sanctions and obtains spare parts for decades old ASML chip making machines: Report
By Anton Shilov published
Russian companies get spare parts for ASML's PAS 5500 lithography steppers from 1990s – 2000s through China-based intermediaries.
Chinese companies spend $26 billion on advanced chipmaking machinery investment
By Anton Shilov published
Ahead of possible new U.S. export regulations, Chinese chipmakers increase purchases of semiconductor fab tools.
The U.S. has sanctioned 18 Chinese fabs, dozens remain in white zone
By Anton Shilov published
The U.S. government approves shipments of wafer fab equipment to many Chinese fabs, other are banned. Question is, can those tools be installed in banned fabs?
TSMC establishes new Foundry 2.0 paradigm — could help address regulatory concerns of a monopoly
By Anton Shilov published
TSMC takes a page from Intel's IDM 2.0, proclaims itself a Foundry 2.0 company.
U.S. planning 'draconian' sanctions against China's semiconductor industry: Report
By Anton Shilov published
U.S. government wants to further restrict curbs for China's semiconductor sector as foreign companies still sell fairly advanced tools to Chinese entities.
Researchers grow sub-nanometer size transistors
By Mark Tyson published
1D metals demonstrated in 2D semiconductor circuits.
Major Chinese semiconductor company goes bankrupt
By Anton Shilov published
Following the collapse of a $3 billion IDM project, doubts are growing about the prospects of China's chip industry.
US government probes South Korean company accused of selling American tools to Chinese entities
By Anton Shilov published
Chinese entities keep getting advanced chipmaking tools made by American companies from South Korean companies.
Russia develops its first lithography tool, and its already 30 years out of date
By Anton Shilov published
Russia can now build lithography system capable of making 350nm chips.
Huawei patent reveals 3nm-class process technology plans — China continues to move forward despite US sanctions
By Anton Shilov published
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
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