Latest about semiconductors
TSMC won't adopt advanced High-NA EUV chipmaking tools until 2030 or later
According to China Renaissance, TSMC might adopt High-NA EUV lithography for a post-1nm process technology in 2030 or later.
Semiconductor industry proposes new 'Chipmaker's Visa' for H1B program
American semiconductor industry needs tens of thousands of foreign workers, so the government has to alter H1-B visa program, U.S. chipmakers believe.
Huawei's 5nm Kirin 9006C laptop chip was reportedly produced by TSMC in 2020, dispelling production rumors at Chinese fab SMIC
Teardown reveals that SMIC did not produce Huawei's 5nm Kirin 9006C laptop processor, it was TSMC in 2020.
Intel receives first High-NA EUV chipmaking tool from ASML
Intel receives the first components of ASML's High-NA EUV scanner.
China's memory maker CXMT reportedly violates U.S. export rules with its 18nm 3D DRAM
CXMT reportedly candidly violates U.S. sanctions with its GAA-based 18nm DRAM process technology with 4F^2 cell design that it presented at IEDM.
China planning 1,600-core chips that use an entire wafer
Chinese Academy of Sciences builds 256-core Zhejiang 'Big Chip,' looking towards wafer-scale chips .
First functional graphene semiconductor paves the path to post-silicon chips
Georgia Tech researchers claim to have created the world's first functional graphene semiconductor material after a decade of refinement and band gap tuning.
Samsung plans to eliminate humans from its chip fabs by 2030
Samsung intends to make its chip fabs human-less by 2030, says report.
