Latest about semiconductors
China's CXMT reportedly aims to make HBM memory for AI chips
CXMT to compete against Micron, Samsung, and SK Hynix for lucrative HBM memory market, says report.
Pentagon now considers China's 3D NAND maker YMTC a 'military company'
Pentagon believes that Yangtze Memory could be supporting China's military complex.
Intel's Ohio fabs could reportedly slip to late 2026 — 'Silicon Heartland' factories were originally planned for 2025
Intel reportedly delays $20 billion Ohio fab project due to govt incentives and chip demand.
New 'stamping' chipmaking technique uses 90% less power than EUV — Canon to ship the first nanoimprint litho tools to customers this year or next
Canon's nanoimprint lithography tools will ship either this year or next, they will address 3D NAND manufacturing first.
Chinese silicon wafer makers to increase capacity to satisfy domestic chip boom: report
In wake of looming chip production capacity increase, Chinese wafer makers ramping up their capacity too.
Chinese DRAM maker CXMT 18.5nm node allegedly complies with U.S. export rules
Chinese maker of DRAM renames its 17nm process technology to 18.5nm, claims it fell short of standard, to comply with U.S. export rules and get advanced fab tools.
Huawei's MatePad Pro hides an unknown Kirin 9000W
Huawei MatePad 13.2-inch tablet uses unknown HiSilicon Kirin 9000W processor.
Intel opens $3.5 billion advanced Foveros 3D chip packaging facility in New Mexico
Intel's Fab 9 that specializes on Foveros 3D packaging starts operations in New Mexico.
