Latest about semiconductors
China planning 1,600-core chips that use an entire wafer
Chinese Academy of Sciences builds 256-core Zhejiang 'Big Chip,' looking towards wafer-scale chips .
First functional graphene semiconductor paves the path to post-silicon chips
Georgia Tech researchers claim to have created the world's first functional graphene semiconductor material after a decade of refinement and band gap tuning.
Samsung plans to eliminate humans from its chip fabs by 2030
Samsung intends to make its chip fabs human-less by 2030, says report.
Intel to reveal its roadmap beyond the 18A (1.8nm) process node in a few weeks
Intel vows to disclose its post-5N4Y roadmap at its IFS Direct Connect event in February.
China to lead semiconductor industry expansion with 18 new fabs in 2024
The SEMI World Fab Forecast report predicts that China will lead the global semiconductor industry expansion in 2024.
TSMC charts a course to trillion-transistor chips
Transistor density will continue to increase with new process technologies, TSMC believes.
Intel secures $3.25B Israeli gov't grant to build $25B chip fab in Israel
Intel to build a $25 billion fab in Israel, set to get $3.25 billion in government grants.
U.S. mulls imposing tariffs on China-made legacy chips
U.S. Commerce Department set to survey companies in other sectors to find out how they procure simplistic, but vital chips.
Chinese chipmaker SMIC is working on 3nm process technology: Report
Without access to leading-edge chip production tools, SMIC remains committed to 5nm and 3nm process technologies.
ASML ships groundbreaking new chipmaking tool to Intel — High-NA lithography tool needed for next-gen process nodes could cost ~$400 million
ASML on Thursday announced that it had begun shipping the industry's first extreme ultraviolet (EUV) lithography tool with a 0.55 numerical aperture (High-NA) to Intel.