semiconductors

Samsung's SF2 to adopt backside power delivery, but it seems that Samsung's SF3 will not, according to a report.

Leading U.S. wafer fab equipment maker under investigation for supplying fab tools to Chinese chipmakers.

When distributing CHIPS and Science Act money, the U.S. government will give preferences to large projects.

The U.S. government plans to provide an update on CHIPS Act implementation on February 26.

$39 billion in grands and $75 billion in loans and loan guarantees apparently not enough to rebuild the U.S. industry.

Arm and Samsung are working together to deliver optimized next-generation Arm Cortex-X and Cortex-A CPU cores on an MBCFET-based node, with gate-all-around transistors.

GlobalFoundries to upgrade U.S. fabs using $1.5 billion funding it gets under the CHIPS act and $600 million from the state of New York.

Intel is in talks with the U.S. government over a $10+ billion subsidies + loans package.

Nvidia's Huang doubts the world needs a major boost to semiconductor industry to make AI ubiquitous.

The transportation of Intel's oversized equipment to its Ohio fab is delayed to February 17.