semiconductors

ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.

Yangtze Memory may jump into the HBM memory business via its XMC foundry unit.

Biden administration will reportedly announce first award to Intel next week.

Nvidia may demonstrate next-generation B100 GPU for AI and HPC applications at the GTC conference next week.

Cerebras unveils Wafer Scale Engine 3: 900,000 AI cores, four trillion transistors, 125 PetaFLOPS AI performance.

China raises tens of billions to fund crucial semiconductor projects amid U.S. sanctions against the sector.

Intel will reportedly get a $3.5 billion investment from the U.S. government to ensure a steady supply of chips for military applications.

The process formerly known as SF3 has now been renamed to SF2.

Baidu tells investors it will have to use its own or domestic processors as getting Nvidia hardware is impossible.

Samsung's SF2 to adopt backside power delivery, but it seems that Samsung's SF3 will not, according to a report.