Latest about semiconductors
Russia develops its first lithography tool, and its already 30 years out of date
Russia can now build lithography system capable of making 350nm chips.
Huawei patent reveals 3nm-class process technology plans — China continues to move forward despite US sanctions
Huawei's self-aligned quadruple patterning patent covers both 3nm and 5nm process technologies, which would allow SMIC and China to create more advanced chips despite the ongoing U.S. sanctions.
CHIPs Act throws its weight behind glass packaging for chips
The first time the CHIPS Act is funding new technology.
Robert Dennard, father of DRAM, is deceased
Robert Heath Dennard, a pioneer in electrical and computer engineering who invented DRAM, passed away on April 23, 2024. He will also be remembered for Dennard Scaling theory, based on Moore’s law.
TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design
TSMC's A16 fabrication process features Super Power Rail backside power delivery, will be available to customers in H2 2026
Researchers create atom-thick gold sheets dubbed Goldene
Production method inspired by Japanese blacksmithing technique.
Samsung plans big capacity jump for SSDs, preps 290-layer V-NAND this year, 430-layer for 2025
Samsung's next-generation 290-layer 3D NAND will use string stacking, says report.
