RAM

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.

Samsung is ending DDR4 production in favor of more lucrative technologies like DDR5 and HBM.

G.Skill has launched the first 256GB (64GBx4) UDIMM memory kit, hitting DDR5-6000 CL32 speeds out-of-the-box with EXPO.

HBM4 offers faster data rates, more channels, and higher memory capacities, with features like Directed Refresh and flexible voltage options to boost performance and reliability.

FMC and Neumonda develop non-volatile FeRAM products, revive memory production in Germany.

G.Skill is introducing high-speed 64GB modules to the market with its latest Trident Z5 Royal Neo 128GB (64GBx2) memory kit, which is advertised to reach DDR5-8000 speeds.

Chinese memory maker CXMT is reportedly preparing to raise DDR4 prices after months of aggressive discounting, as demand stabilizes and major suppliers shift focus to newer memory types.