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China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies
By Luke James published
Premium Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.

Intel shows off leading-edge tech with massive AI processor test vehicle
By Anton Shilov published
Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.

Ongoing trade war has TSMC and Taiwan stuck between a rock and a hard place
By Bruno Ferreira published
Premium The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.

Nvidia CEO denies US wants to shift 40% of Taiwan's chipmaking capacity to America
By Anton Shilov published
Silicon shield will remain with Taiwan.

ASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom
By Anton Shilov published
Premium ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.

Samsung's Taylor, Texas fab could herald a breakthrough for the chipmaker, company plans 2026 risk production
By Anton Shilov published
Premium 50,000 wafer starts per month?

Bill Gates-backed silicon photonics startup develops optical transistors 10,000x smaller than current tech
By Jowi Morales published
Will this let us break free from the limitations of current silicon technology?

Intel says it has two prospective customers for 14A
By Anton Shilov published
Intel claims that customers show interest in the 14A process technology; however, they have yet to make a commitment to use it.
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