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Latest News

SoftBank to manufacture its own batteries to power AI data centers
By Luke James published
The Japanese company is partnering with two South Korean startups, Cosmos Lab and DeltaX, to produce zinc-halogen batteries.

Google cybersecurity boffins found at least one AI-developed zero-day exploit
By Bruno Ferreira published
Google cybersecurity boffins found at least one AI-developed zero-day exploit

China's next-gen CPUs and GPUs prepare to challenge Intel Alder Lake and AMD RX 550 in 2027
By Zhiye Liu published
Loongson has provided updates on the company's upcoming 3B6600 processor and 9A1000 graphics card during its 2025 annual and 2026 Q1 earnings calls.

Microsoft's massive Kenya AI data center would require switching off 'half the country' to meet power requirements, government says
By Luke James published
The project was supposed to bring a geothermal-powered data center to the Olkaria region in Kenya's Rift Valley.

AMD is reportedly developing an entry-level RDNA 4 GPU, the RX 9050, with 8GB of VRAM
By Aaron Klotz published
AMD is allegedly planning to launch an RX 9050 SKU to compete with the RTX 5050, featuring more cores than the OEM-exclusive RX 9060.

Samsung holds desperate final talks with union over 18-day chip factory strike that could cost $20 billion
By Luke James published
The two sides are meeting through South Korea's National Labor Relations Commission after earlier rounds of mediation in February and March collapsed.

The tech industry is moving faster than ever. Keep up with Tom’s Hardware Premium, available from just $7 per month
By The Editors of Tom's Hardware published
The chipmaking industry is moving at breakneck speed — you can keep up to date with our Premium subscription.

AI data center developers target rural territory to bypass city construction bans and regulations
By Jowi Morales published
Developers are looking for the path of least resistance to build their data center projects.

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration
By Luke James published
The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.
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