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PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
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PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
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PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
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Premium Features
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PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
By Jake Roach Published -
PremiumThe great Bench GPU retest begins — how we're testing for our GPU Hierarchy in 2026, and why upscaling and framegen are still out
By Jeffrey Kampman Published -
PremiumThe state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress
By Anton Shilov Published -
PremiumWi-Fi 7 promises made, but not kept — the mysteries of MLO and AFC, and looking toward Wi-Fi 8
By Brandon Hill Published -
PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published
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Roadmaps
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PremiumUALink roadmap plots course to optimized AI data center interconnects
By Anton Shilov Published -
PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
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News Analysis
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PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
By Luke James Published -
PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James Published -
PremiumInside Meta and AMD's $100 billion deal, and why AMD is giving up a slice of the company in return for GPU orders
By Sayem Ahmed Published -
PremiumSambanova introduces new AI accelerator, partners with Intel to deploy Xeon CPUs for inferencing and agentic workloads
By Anton Shilov Published -
PremiumAI boosted US economy by 'basically zero' in 2025, says Goldman Sachs chief economist
By Jon Martindale Published -
PremiumOpenAI couldn’t finance its data centers, so it took control of the hardware instead
By Luke James Published
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Latest
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PremiumNvidia refutes reports of HBM4 mass production delay, production 'on track' for the second half of 2025
By Luke James Published -
PremiumMicron to begin work on $100 billion New York 'megafab' imminently
By Anton Shilov Published -
PremiumNvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch
By Luke James Published -
PremiumNvidia's focus on rack-scale AI systems is a portent for the year to come
By Luke James Published -
PremiumChina’s GPU cloud consolidates around Baidu and Huawei as domestic AI chips scale up
By Luke James Published -
PremiumChina’s top chip foundries move to consolidate as Beijing pushes semiconductor self-sufficiency
By Luke James Published -
PremiumChip scarcity assaults auto industry amid the worsening Nexperia and DRAM crisis
By Chris Stokel-Walker Published -
PremiumU.S. electricity grid stretches thin as data centers rush to turn on onsite generators
By Jowi Morales Published -
PremiumMicron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies
By Luke James Published -
PremiumA deeper look at the tightened chipmaking supply chain, and where it may be headed in 2026
By Chris Stokel-Walker Published -

Huawei’s Ascend and Kunpeng progress shows how China is rebuilding an AI compute stack under sanctions
By Luke James Published -
PremiumNvidia's CUDA Tile examined: AI giant releases programming style for Rubin, Feynman, and beyond
By Anton Shilov Published
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