3D NAND
Latest about 3D NAND

Xiaomi Reportedly Using China-Based YMTC's 232-Layer 3D NAND Memory
By Anton Shilov published
Xiaomi's 14 Pro smartphone is set to take advantage of YMTC's 232-layer 3D NAND memory with Xtacking 3.0 architecture.

Chinese Minister Welcomes Micron's Expansion in the Country, On the Heels of Memory IC Ban
By Anton Shilov published
Chinese Ministry of Commerce welcomes Micron's foreign investment in the country.

China Increases Investment in Domestic Memory Maker to $5.4 Billion: Report
By Anton Shilov published
Changxin Xinqiao Memory Technologies gets $5.4 billion from Big Fund.

China Chipmaker YMTC Spent $7 Billion to Overcome U.S. Sanctions
By Anton Shilov published
YMTC taps Chinese equipment makers to produce wafer fab equipment it needs.

China's Blacklisted YMTC Ships World-Leading 232-Layer 3D QLC NAND
By Anton Shilov published
YMTC first to ship 232-layer 3D QLC NAND memory, ahead of Micron, SK Hynix, and Solidigm.

Western Digital and Kioxia Halt Merger Talks: Report
By Anton Shilov published
Western Digital and Kioxia failed to create world's largest maker of NAND memory.

SK Hynix Objects to Kioxia-Western Digital Merger
By Anton Shilov published
SK Hynix does not like the idea of creating the world's largest maker of NAND.

Western Digital and Kioxia to Announce Merge This Month: Report
By Anton Shilov published
Western Digital and Kioxia are close to forming the world's largest NAND maker.
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