Latest about 3D NAND
Kioxia's next-gen 3D NAND production gets expedited to 2026, report claims
Premium Mass production of 332-layer BiCS10 accelerated from 2027 to 2026.
The RAM pricing crisis has only just started, memory maker Team Group warns
A 16 Gb DDR5 chip already costs $27.
SK hynix unveils AI NAND strategy, including gargantuan petabyte-class QLC SSDs — ultra-fast HBF and 100M IOPS SSDs also in the pipeline
NAND for AI.
China's premier memory-maker YMTC struggles amid chokehold of US sanctions
YMTC's efforts to expand its presence in the 3D NAND memory market have stalled as US export restrictions prevent the company from acquiring advanced tools needed to scale production.
Nvidia and Kioxia target 100 million IOPS SSD in 2027
Kioxia is working with Nvidia to develop a 100 million IOPS SSD for AI servers by 2027, likely leveraging unconventional NAND architectures.
U.S. government considers annual permits for Samsung and SK hynix to supply equipment to their Chinese fabs
What about TSMC?
Intel, Samsung, and SK hynix hit by another abrupt US policy change
They face a 120 day deadline
Inside the future of 3D NAND: The roadmap to 500 layers
Premium The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
