Latest about 3D NAND
Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool
SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.
Micron to get $6 billion from U.S. gov't to build memory fabs: Report
U.S. government to support Micron's EUV DRAM fab, other fab projects in the U.S. with $6 billion according to Bloomberg.
Samsung plans big capacity jump for SSDs, preps 290-layer V-NAND this year, 430-layer for 2025
Samsung's next-generation 290-layer 3D NAND will use string stacking, says report.
Kioxia aims to mass produce 1000-layer 3D NAND by 2031 — quadruple the current number of layers
Kioxia expects 1,000-layer 3D NAND memory in six or seven years using innovative production methods.
Chinese flash memory maker claims breakthrough - QLC NAND matches endurance of TLC NAND
YMTC's X3-6070 3D QLC NAND can sustain 4,000 P/E cycles, according to the company.
Samsung details petabyte SSD subscription service, uses custom-built servers
Samsung's PBSSD as a Service will use custom-built servers and will be available to service providers.
Samsung to unveil petabyte SSD subscription storage service for AI: Report
Samsung's new service reportedly targets AI developers with growing storage requirements.
Kioxia offers to make chips for SK Hynix to help revive merger talks with Western Digital: Report
Kioxia proposes to make 3D NAND for SK Hynix to change its mind about its merger with Western Digital.
