Latest about 3D NAND
Chinese Chipmaker Asks Suppliers to Buy Back Banned Fab Tools
YMTC chairman warns about turmoil and disorder in the semiconductor industry.
U.S. to Let Samsung, SK Hynix, TSMC Expand Fabs in China: Report
U.S. set to allow South Korean and Taiwanese companies to upgrade fab operations in China using American wafer fab tools.
Kioxia and Western Digital Intensify Merger Talks: Report
Kioxia and Western Digital advance merger talks as prices and demand for flash memory fall.
10,000 Chinese Chip Developers Closed Shop in 2021–2022
Over 10,000 Chinese chip developers closed up shop during the past two years, as the investment bubble crash and global semiconductor downturn hit hard.
Kioxia and WD to Present Details on 3D NAND With 300+ Layers
Kioxia, Western Digital, and Tokyo Electron will present papers covering next-generation 3D NAND memory with over 300 – 400 layers.
Samsung to Cut 3D NAND and DRAM Production
Samsung to lower memory production to balance supply and demand on the market.
SSD Market to Hit $67 Billion in 2028, 130% Growth From Today
Despite declining average prices, SSD market is poised to grow.
Kioxia and WD Unveil World's Fastest 3D NAND Flash Memory
Kioxia's and Western Digital's 218-layer 3D NAND device boasts 1Tb capacity, 3.2 GT/s interface speed.