3D NAND
Latest about 3D NAND

China's Blacklisted YMTC Ships World-Leading 232-Layer 3D QLC NAND
By Anton Shilov published
YMTC first to ship 232-layer 3D QLC NAND memory, ahead of Micron, SK Hynix, and Solidigm.

Western Digital and Kioxia Halt Merger Talks: Report
By Anton Shilov published
Western Digital and Kioxia failed to create world's largest maker of NAND memory.

SK Hynix Objects to Kioxia-Western Digital Merger
By Anton Shilov published
SK Hynix does not like the idea of creating the world's largest maker of NAND.

Western Digital and Kioxia to Announce Merge This Month: Report
By Anton Shilov published
Western Digital and Kioxia are close to forming the world's largest NAND maker.

Samsung Says 300+ Layer V-NAND is On Track for 2024
By Anton Shilov published
3D NAND memory will keep gaining capacity and performance in the coming years, Samsung believes.

Western Digital Finalizing Plans to Merge With Kioxia: Report
By Anton Shilov published
Western Digital is on the finish line with Kioxia acquisition, says Nikkei.

TSMC Expects to Get Permanent Approval to Equip Chinese Fab (Updated)
By Anton Shilov published
TSMC got a waiver to equip its Nanjing fab in China with U.S. tools, but it wants a permanent permission.

TSMC to Get Permission for Chinese Fab Operations from U.S. Govt: Report
By Anton Shilov published
The U.S. government may grant a one-year license to TSMC to upgrade its Fab 16 in Nanjing, China.
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