Latest about 3D NAND
China's YMTC Preps Next-Gen Xtacking 4.0 NAND Tech
Yangtze Memory proceeds to Xtacking 4.0 architecture, but without increasing the number of layers.
Chinese Memory Maker YMTC Sues Micron for 3D NAND Patents Violation
The China-based YMTC memory maker accuses Micron of violating crucial 3D NAND patents.
Xiaomi Reportedly Using China-Based YMTC's 232-Layer 3D NAND Memory
Xiaomi's 14 Pro smartphone is set to take advantage of YMTC's 232-layer 3D NAND memory with Xtacking 3.0 architecture.
Chinese Minister Welcomes Micron's Expansion in the Country, On the Heels of Memory IC Ban
Chinese Ministry of Commerce welcomes Micron's foreign investment in the country.
China Increases Investment in Domestic Memory Maker to $5.4 Billion: Report
Changxin Xinqiao Memory Technologies gets $5.4 billion from Big Fund.
China Chipmaker YMTC Spent $7 Billion to Overcome U.S. Sanctions
YMTC taps Chinese equipment makers to produce wafer fab equipment it needs.
China's Blacklisted YMTC Ships World-Leading 232-Layer 3D QLC NAND
YMTC first to ship 232-layer 3D QLC NAND memory, ahead of Micron, SK Hynix, and Solidigm.
Western Digital and Kioxia Halt Merger Talks: Report
Western Digital and Kioxia failed to create world's largest maker of NAND memory.
