3D NAND

High-capacity SSDs might get cheaper as Western Digital and Kioxia are prepping BiCS8 2Tb 3D QLC NAND devices.

SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.

U.S. government to support Micron's EUV DRAM fab, other fab projects in the U.S. with $6 billion according to Bloomberg.

Samsung's next-generation 290-layer 3D NAND will use string stacking, says report.

Kioxia expects 1,000-layer 3D NAND memory in six or seven years using innovative production methods.

YMTC's X3-6070 3D QLC NAND can sustain 4,000 P/E cycles, according to the company.

Samsung's PBSSD as a Service will use custom-built servers and will be available to service providers.

Samsung's new service reportedly targets AI developers with growing storage requirements.

Kioxia proposes to make 3D NAND for SK Hynix to change its mind about its merger with Western Digital.

Two new facilities will cater to the AI industry and data centers.