3D NAND

Some of YMTC's patents can actually belong to Micron, the company alleges.

A Munich court has granted YMTC two injunctions against Micron over 3D NAND patents, the latest development in a years-long cross-border legal battle between the memory rivals.

China's DRAM champion CXMT is reportedly planning to enter 3D NAND production as it plots 3D NAND research programs and pilot line at its future fab near Beijing.

As demand for high-end data center SSDs peak, SK hynix upgrades its Chinese facilities and plans Solidigm listing at NASDAQ.

Kioxia and Sandisk introduce BiCS10 3D QLC NAND device with a record areal density of over 37 Gbit/mm^2.

U.S. lawmakers demand Commerce Secretary Howard Lutnick to ban imports of memory chips from China to the U.S., ask allies to do the same.

Kioxia, Sandisk begin to sample BiCS10 3D NAND: 332 active layers and over 29 Gb/mm2 areal capacity.

SK hynix announces major plan to spend $712.5 billion in its operations in South Korea, but the only detailed investments are spendings on a new NAND fab and a packaging facility.

Micron has signed 16 LTAs with various customers to supply DRAM and NAND worth $100 billion.

Biwin signs a 24-months supply agreement with an unknown NAND maker to get memory worth $1.86 billion.