Latest about 3D NAND
China's YMTC Starts Producing Mysterious New Memory, Ups 3D NAND Prices
Despite the market downturn, YMTC ups 3D NAND prices in China.
WD May Spin Off Flash Business and Merge It with Kioxia: Report
Western Digital may spin off the NAND business to merge it with Kioxia.
Chinese Chipmaker Asks Suppliers to Buy Back Banned Fab Tools
YMTC chairman warns about turmoil and disorder in the semiconductor industry.
U.S. to Let Samsung, SK Hynix, TSMC Expand Fabs in China: Report
U.S. set to allow South Korean and Taiwanese companies to upgrade fab operations in China using American wafer fab tools.
Kioxia and Western Digital Intensify Merger Talks: Report
Kioxia and Western Digital advance merger talks as prices and demand for flash memory fall.
10,000 Chinese Chip Developers Closed Shop in 2021–2022
Over 10,000 Chinese chip developers closed up shop during the past two years, as the investment bubble crash and global semiconductor downturn hit hard.
Kioxia and WD to Present Details on 3D NAND With 300+ Layers
Kioxia, Western Digital, and Tokyo Electron will present papers covering next-generation 3D NAND memory with over 300 – 400 layers.
Samsung to Cut 3D NAND and DRAM Production
Samsung to lower memory production to balance supply and demand on the market.