Latest about 3D NAND
Kioxia launches BiCS9 NAND samples with hybrid design and Toggle 6.0 interface, blending performance with efficiency
A transitional step for manufacturing and performance tuning ahead of BiCS10’s more complex, high-density architecture.
China's YMTC moves to break free of U.S. sanctions by building production line with homegrown tools
News Analysis Can YMTC deliver what it promises?
Micron balks at court order to share 73 pages of sensitive data with China's banned YMTC chipmaker
Micron has petitioned the Supreme Court to reverse earlier rulings that granted YMTC’s legal team access to 73 pages of confidential 3D NAND documents, citing national security concerns.
Samsung unveils 10th Gen V-NAND: 400+ layers, 5.6 GT/s and hybrid bonding
Samsung's 10th Gen V-NAND uses 400+ layers, adopts Cell-on-Peripheral with hybrid bonding architecture.
Chinese chipmaker unveils Optane-like storage class memory
Numemory has 64Gb and 128Gb storage class memory devices with industry-standard NAND interface that could be used for SSDs, expensive SSDs.
Chinese chipmaker ships record-breakers: YMTC quietly begins shipping 5th Gen 3D TLC NAND
Analysis of YMTC's 294-layer 3D NAND indicates that the company continues to advance despite U.S. sanctions.
Phison unveils PS5028-E28 PCIe 5.0 SSD controller
SSDs using Phison's PS5028-E28 SSD controller could arrive in 2026
China now producing its own blank wafers as domestic memory company ramps up 3D NAND production — YMTC consumes 500,000 homegrown wafers per month
Despite sanctions imposed by the U.S. government, YMTC is ramping up production of 3D NAND at a rapid pace.
