3D NAND

Western Digital may spin off the NAND business to merge it with Kioxia.

YMTC chairman warns about turmoil and disorder in the semiconductor industry.

U.S. set to allow South Korean and Taiwanese companies to upgrade fab operations in China using American wafer fab tools.

Kioxia and Western Digital advance merger talks as prices and demand for flash memory fall.

Over 10,000 Chinese chip developers closed up shop during the past two years, as the investment bubble crash and global semiconductor downturn hit hard.

Kioxia, Western Digital, and Tokyo Electron will present papers covering next-generation 3D NAND memory with over 300 – 400 layers.

Samsung to lower memory production to balance supply and demand on the market.

Despite declining average prices, SSD market is poised to grow.

Kioxia's and Western Digital's 218-layer 3D NAND device boasts 1Tb capacity, 3.2 GT/s interface speed.

Micron will further cut investments and reduce workforce due to short-term 3D NAND and DRAM demand uncertainties.