3D NAND
Latest about 3D NAND

NAND and DRAM prices dropping in spot market, continuing downward trend
By Anton Shilov published
As memory module and SSD makers have loads of chips in stock, they do not buy ICs on spot market, which is why the spot prices of memory decrease.

Kioxia ends production cutting strategy — 3D NAND prices could stabilize or decline
By Anton Shilov published
Kioxia puts an end to its 3D NAND production cuts that were initiated in October, 2022.

WD unveils world's highest-capacity flash memory chip — 2Tb 3D QLC flash chips open the door to bigger and cheaper SSDs
By Anton Shilov, Paul Alcorn published
High-capacity SSDs might get cheaper as Western Digital and Kioxia are prepping BiCS8 2Tb 3D QLC NAND devices.

Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool
By Anton Shilov published
SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.

Micron to get $6 billion from U.S. gov't to build memory fabs: Report
By Anton Shilov published
U.S. government to support Micron's EUV DRAM fab, other fab projects in the U.S. with $6 billion according to Bloomberg.

Samsung plans big capacity jump for SSDs, preps 290-layer V-NAND this year, 430-layer for 2025
By Anton Shilov published
Samsung's next-generation 290-layer 3D NAND will use string stacking, says report.

Kioxia aims to mass produce 1000-layer 3D NAND by 2031 — quadruple the current number of layers
By Anton Shilov published
Kioxia expects 1,000-layer 3D NAND memory in six or seven years using innovative production methods.

Chinese flash memory maker claims breakthrough - QLC NAND matches endurance of TLC NAND
By Anton Shilov published
YMTC's X3-6070 3D QLC NAND can sustain 4,000 P/E cycles, according to the company.
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