Latest about 3D NAND
U.S. government considers annual permits for Samsung and SK hynix to supply equipment to their Chinese fabs
What about TSMC?
Intel, Samsung, and SK hynix hit by another abrupt US policy change
They face a 120 day deadline
Inside the future of 3D NAND: The roadmap to 500 layers
Premium The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
Kioxia launches BiCS9 NAND samples with hybrid design and Toggle 6.0 interface, blending performance with efficiency
A transitional step for manufacturing and performance tuning ahead of BiCS10’s more complex, high-density architecture.
China's YMTC moves to break free of U.S. sanctions by building production line with homegrown tools
News Analysis Can YMTC deliver what it promises?
Micron balks at court order to share 73 pages of sensitive data with China's banned YMTC chipmaker
Micron has petitioned the Supreme Court to reverse earlier rulings that granted YMTC’s legal team access to 73 pages of confidential 3D NAND documents, citing national security concerns.
Samsung unveils 10th Gen V-NAND: 400+ layers, 5.6 GT/s and hybrid bonding
Samsung's 10th Gen V-NAND uses 400+ layers, adopts Cell-on-Peripheral with hybrid bonding architecture.
Chinese chipmaker unveils Optane-like storage class memory
Numemory has 64Gb and 128Gb storage class memory devices with industry-standard NAND interface that could be used for SSDs, expensive SSDs.
