Latest about 3D NAND
Samsung unveils 10th Gen V-NAND: 400+ layers, 5.6 GT/s and hybrid bonding
Samsung's 10th Gen V-NAND uses 400+ layers, adopts Cell-on-Peripheral with hybrid bonding architecture.
Chinese chipmaker unveils Optane-like storage class memory
Numemory has 64Gb and 128Gb storage class memory devices with industry-standard NAND interface that could be used for SSDs, expensive SSDs.
Chinese chipmaker ships record-breakers: YMTC quietly begins shipping 5th Gen 3D TLC NAND
Analysis of YMTC's 294-layer 3D NAND indicates that the company continues to advance despite U.S. sanctions.
Phison unveils PS5028-E28 PCIe 5.0 SSD controller
SSDs using Phison's PS5028-E28 SSD controller could arrive in 2026
China now producing its own blank wafers as domestic memory company ramps up 3D NAND production — YMTC consumes 500,000 homegrown wafers per month
Despite sanctions imposed by the U.S. government, YMTC is ramping up production of 3D NAND at a rapid pace.
Kioxia forecasts a tripling in demand for NAND memory by 2028 — could further impact SSD pricing
Kioxia expresses optimism about 3D NAND demand in the coming years, re-emphasizes plans to kick of production at its second 3D NAND facility in Kitakami.
Industry considers cutting production of 3D NAND amid dropping prices
Leading memory makers may reconsider their production plans and convert NAND capacity to DRAM capacity.
China's 3D NAND leader YMTC gradually switching to homegrown chipmaking tools
While China-based YMTC increases share of domestic tools, it still cannot reject equipment made in Europe and the U.S.