Latest about 3D NAND
Banks Gear Up to Fund Western Digital's Buyout of Kioxia
Japanese banks are ready to finance buyout of Kioxia by Western Digital.
Samsung to Produce 300-Layer V-NAND in 2024: Report
Samsung to use double-stack architecture for 300-layer 3D V-NAND memory, according to a leak.
China's YMTC Boosts SSDs With 232-Layer 3D NAND Memory
SSDs based on YMTC's leading-edge 232-layer 3D NAND readily available in China.
SK Hynix Sees DRAM Market Recovery Due to AI Servers
SK Hynix says demand for HBM and DDR5 memory drives revenue growth.
China's YMTC Starts Producing Mysterious New Memory, Ups 3D NAND Prices
Despite the market downturn, YMTC ups 3D NAND prices in China.
WD May Spin Off Flash Business and Merge It with Kioxia: Report
Western Digital may spin off the NAND business to merge it with Kioxia.
Chinese Chipmaker Asks Suppliers to Buy Back Banned Fab Tools
YMTC chairman warns about turmoil and disorder in the semiconductor industry.
U.S. to Let Samsung, SK Hynix, TSMC Expand Fabs in China: Report
U.S. set to allow South Korean and Taiwanese companies to upgrade fab operations in China using American wafer fab tools.
