Latest about SK Hynix
SK hynix to showcase 16-layer HBM3E, 122TB enterprise SSD, LPCAMM2, and more at CES
The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance
US Department of Commerce finalizes $458 million grant for SK Hynix to build Indiana packaging plant
SK Hynix gets $458 million from the U.S. government via the CHIPS Act to build an HBM packaging plant in Indiana.
Samsung and SK hynix will detail GDDR7 with transfer rates up to 42.5 GT/s
Samsung and SK hynix to describe their next-generation GDDR7 technologies that will enable data transfer rates of up to 42 GT/s.
Chinese DDR4 producers are undercutting South Korean rivals' pricing by 50%
To capture market share, Chinese DRAM makers offer DDR4 memory with a 50% discount.
Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report
SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.
SK hynix announces the world's first 48GB 16-Hi HBM3E memory
In an industry-first, SK hynix has announced its 16-Hi HBM3E memory, offering capacities of 48GB per stack alongside other bleeding-edge NAND/DRAM products.
Analyst firm raises alarm about EUV chipmaking tool power consumption
Leading-edge semiconductor fabs to consume 54,000 Gigawatts a year by 2030, which is more than some countries consume today.
Industry considers cutting production of 3D NAND amid dropping prices
Leading memory makers may reconsider their production plans and convert NAND capacity to DRAM capacity.
