Latest about SK Hynix
Samsung, SK Hynix, and Micron are teaming up to block memory hoarding.
Premium ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.
Premium Solidigm brand to be spun off into a new subsidiary in the process
Premium Company prepares for next-gen HBM4E, HBM5, and HBM5E memory.
SK Hynix demonstrates 48 GB HBM4 memory with a 2,048-bit interface over at up to10 GT/s
Sandisk and other key suppliers of 3D NAND are projected to significantly increase prices of enterprise-grade 3D NAND memory in the coming months due to overwhelming demand from the AI sector.
The U.S. is playing it safe when it comes to chipmaking tools entering China.
SK hynix is bringing its HBM ambitions to U.S. soil with a $3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana.
The U.S. government has approved annual export licenses allowing Samsung Electronics and SK hynix to ship chipmaking equipment to their manufacturing facilities in China throughout 2026.
Premium SK hynix is expanding its U.S. presence with a new office in the Seattle metropolitan area, placing the world’s leading HBM supplier within minutes of Nvidia, Amazon, and Microsoft.