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By Brandon Hill Published
Premium We chatted with Valve engineers Pierre-Loup Griffais and Jeff Leinbaugh about launching the Steam Frame amid a global memory/storage supply crunch

By Andrew E. Freedman Published
Premium At IFA 2026, a bifurcated computing landscape widened as more companies chased Apple's MacBook Neo while also keeping one foot firmly planted in the AI space.

By Etiido Uko Published
Premium Anjinomoto's secret sauce.

By Sponsored Published
Sponsor Content Created With Dell
The new XPS 13, which has earned plenty of positive comments, is one of the latest laptops on the market that can go head-to-head against even the most advanced tablets.

By Jeffrey Kampman Published
Premium Following the release of Qwen 3.8 27B, we put our trusty hardware to the test to see which hardware might be best suited for running this open-weight AI model.

By Luke James Published
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.

By Luke James Published
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
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