News Analysis
Latest News Analysis

IBM and Cisco agree to lay the foundations for a quantum internet
By Luke James published
Premium IBM and Cisco have announced plans to jointly build a distributed quantum computing network capable of linking fault-tolerant systems over long distances.

Huawei's Ascend AI chip ecosystem scales up as China pushes for semiconductor independence
By Luke James published
Premium Huawei’s in-house Ascend processors and their surrounding supplier network are being positioned as the foundation of a national effort to build an independent, fully domestic semiconductor ecosystem.

Microsoft unveils Azure Cobalt 200 CPU, in-house chip targets higher performance and deeper integration
By Luke James published
Premium Microsoft has revealed its next major in-house server processor, the Azure Cobalt 200, a 132-core Arm-based CPU built on TSMC’s 3nm process.

Anthropic signs $30 billion deal with Amazon to deploy Claude on AWS
By Jon Martindale published
Premium Nvidia, Microsoft and Amazon hitch up with Anthropic

GPU depreciation could be the next big crisis coming for AI hyperscalers
By Jon Martindale published
Premium Even hyperscalers risk becoming unprofitable.

YMTC moves ahead with third chipmaking fab in Wuhan despite U.S. sanctions
By Luke James published
Premium Amid a global memory shortage, China's YMTC has set its sights on building a third semiconductor plant in Wuhan, with the facility expected to begin mass production of memory chips by 2027.

IBM unveils new 'Quantum Nighthawk' 120-qubit processor and software stack
By Luke James published
Premium IBM has detailed its most significant quantum computing advances to date, revealing new hardware and software designed to push the limits of what today’s superconducting qubits can do.

DARPA invests $1.4 billion to build experimental Texas foundry for next-generation 3D chips
By Luke James published
Premium A new DARPA- and Texas-backed facility will focus on 3D heterogeneous integration, stacking, and combining multiple materials and chip types to advance U.S. capabilities in defense, AI, and HPC.
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