Latest News Analysis
SK hynix to build first U.S. packaging plant for HBM
SK hynix is bringing its HBM ambitions to U.S. soil with a $3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana.
SoftBank stakes $4B on securing AI data center power and capacity
Premium SoftBank has agreed to acquire DigitalBridge in a deal valuing the digital infrastructure investor at roughly $4 billion, including debt.
Nvidia's $20 billion Groq IP deal bolsters AI market domination
Premium Nvidia has announced a $20 billion deal to acquire Groq’s intellectual property, though not the company itself, and absorb key members of its engineering team.
Nvidia reportedly backs away from its effort to make its own public cloud, team reorg eases friction with customers
Premium Nvidia has reorganized its cloud computing group, further scaling back its ambitions to operate a public cloud service that would directly compete with Amazon Web Services.
How China’s control of battery supply chains is becoming a critical risk for U.S. military power and AI initiatives
From AI data centers to military drones, the U.S. is increasingly dependent on battery technologies and materials dominated by Chinese firms.
China chipmaker SMIC raises wafer prices by about 10% as memory demand tightens capacity
The adjustment comes as China’s largest foundry runs near full utilization and faces sustained demand from domestic customers building inventories of memory and logic chips.
SK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers
Premium SK hynix is expanding its U.S. presence with a new office in the Seattle metropolitan area, placing the world’s leading HBM supplier within minutes of Nvidia, Amazon, and Microsoft.
China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip
Premium Recreating an entire supply chain is incredibly difficult
