Latest News Analysis
SK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers
Premium SK hynix is expanding its U.S. presence with a new office in the Seattle metropolitan area, placing the world’s leading HBM supplier within minutes of Nvidia, Amazon, and Microsoft.
China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip
Premium Recreating an entire supply chain is incredibly difficult
Former Chinese gaming company with China govt ties accused of smuggling banned AI GPUs
U.S. export policy is colliding with the realities of globalized supply chains, reseller-driven distribution models, and explosive demand for AI accelerators in China.
Nvidia prepares shipment of 82,000 AI GPUs to China as chip war lines blur
U.S. policy reversal opens the door for mid-February exports.
Chinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines
Premium Chinese fabs are quietly extending the useful life and performance of older ASML deep ultraviolet lithography systems by upgrading key subsystems, as Beijing pushes to sustain advanced chip output.
Samsung introduces SOCAMM2 LPDDR5X memory module for AI data centers
Premium The LPDDR5X-based module is being positioned as a standardized, serviceable alternative to soldered memory as AI servers chase higher bandwidth.
Huawei's AI chip capabilities still pale in comparison to American silicon
Premium A new report from the Council on Foreign Relations concludes that Huawei’s AI chip capabilities lag behind Nvidia’s by a wide margin, and that the gap is growing exponentially.
Kioxia's next-gen 3D NAND production gets expedited to 2026, report claims
Premium Mass production of 332-layer BiCS10 accelerated from 2027 to 2026.
New 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
Premium Japan’s Dai Nippon Printing (DNP) claims to have developed a nanoimprint lithography template capable of patterning logic with a feature size of 1.4nm, with plans for mass production in 2027.
