Deep Analysis
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PremiumBlockchain-assisted cyberattacks surge fivefold, driven by Iranian and North Korean state actors, Russia-linked groupsBlockchain dead drops technique stores malicious payloads on blockchains
By Etiido Uko Published -
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PremiumSilicon is starting to design silicon — how AI is being used in chipmaking, from EDA tools to OpenAI's Jalapeño and beyondHow close is AI to designing the very same chips it runs on? We explore how artificial intelligence is being used in modern chip design today.
By Anton Shilov Published -
PremiumIntel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVsThis follows over a decade of Intel investment in glass substrate technology.
By Jon Martindale Published
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PremiumHot Chips 2026: Fujitsu's Monaka CPU stacks its entire cache on a separate 5nm die and narrows to 256-bit SVE2Fujitsu details its Monaka server CPU
By Luke James Published -
PremiumHot Chips 2026: High Bandwidth Flash promises massive bandwidth and capacity, but its usability is extremely limitedOXMIQ presented its High Bandwidth Flash (HBF) use-case scenarios at Hot Chips 2026, which dramatically narrow the circumstances under which HBF makes sense.
By Anton Shilov Published -
PremiumHot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per cardHeading into production during the tightest DRAM market in more than a decade.
By Luke James Published -
PremiumHot Chips 2026: Arm details AGI server CPU with two 70-core N3P chipletsArm reveals more details about its AGI processors with up to 136 cores, but fails to disclose performance.
By Anton Shilov Published -
PremiumHot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memorySamsung detailed the industry's first LPDDR5X-PIM at Hot Chips 2026, adding logic directly to memory to speed up data-intensive workloads like AI inference.
By Jake Roach Published -
PremiumHot Chips 2026: Intel details cutting-edge tech in entry-level Wildcat LakeIntel's Wildcat Lake is competing in the budget laptop market, but it takes a very different approach, leveraging a UCIe interconnect and Intel's latest 18A node.
By Jake Roach Published -
PremiumHot Chips 2026: Intel dives deep on Crescent Island AI acceleratorXe3P focuses on the most compute-intensive phases of AI inference.
By Jeffrey Kampman Published -
PremiumChina strategically slows exports of critical materials used in semiconductor fabrication to TaiwanChina slows exports of germanium, quartz-based materials, and magnets. The move potentially disrupts the optical connectivity, semiconductor, and robotics industries.
By Anton Shilov Published -
PremiumHot Chips 2026: Micron warns HBM wafer penalty is widening with every generationMicron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
By Luke James Published
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