News Analysis
Latest News Analysis

Google TPUs garner attention as AI chip alternative, but are only a minor threat to Nvidia's dominance
By Luke James published
Premium Meta’s reported deal with Google shows a growing interest in alternative AI hardware, but Nvidia says its platform remains unmatched.

Taiwan's $3.2 billion plan for 'AI island' with data centers, quantum hubs and AI robotics labs faces risks
By Luke James published
Premium Taiwan has confirmed it will allocate over NT$100 billion — around US$3.2 billion — for a multi-year national AI infrastructure plan, to become a global leader in AI compute and hardware by 2040.

TSMC's CoWoS packaging capacity reportedly stretched due to AI demand
By Luke James published
Premium As TSMC hits a supply-side wall with CoWoS, Intel may be positioned to provide reprive with EMIB and Foveros.

IBM and Cisco agree to lay the foundations for a quantum internet
By Luke James published
Premium IBM and Cisco have announced plans to jointly build a distributed quantum computing network capable of linking fault-tolerant systems over long distances.

Huawei's Ascend AI chip ecosystem scales up as China pushes for semiconductor independence
By Luke James published
Premium Huawei’s in-house Ascend processors and their surrounding supplier network are being positioned as the foundation of a national effort to build an independent, fully domestic semiconductor ecosystem.

Microsoft unveils Azure Cobalt 200 CPU, in-house chip targets higher performance and deeper integration
By Luke James published
Premium Microsoft has revealed its next major in-house server processor, the Azure Cobalt 200, a 132-core Arm-based CPU built on TSMC’s 3nm process.

Anthropic signs $30 billion deal with Amazon to deploy Claude on AWS
By Jon Martindale published
Premium Nvidia, Microsoft and Amazon hitch up with Anthropic

GPU depreciation could be the next big crisis coming for AI hyperscalers
By Jon Martindale published
Premium Even hyperscalers risk becoming unprofitable.

YMTC moves ahead with third chipmaking fab in Wuhan despite U.S. sanctions
By Luke James published
Premium Amid a global memory shortage, China's YMTC has set its sights on building a third semiconductor plant in Wuhan, with the facility expected to begin mass production of memory chips by 2027.
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