Latest about Manufacturing
Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product
EPA faces lawsuit over claims it fast-tracked approval of toxic 'data center chemicals'
These chemicals are crucial for semiconductor manufacturing, but they must also come with a lot of safety rules to prevent them from leaking out and poisoning the environment.
Hot Chips 2026: Nvidia presents Groq 3 LPX architecture and unveils its first third-party inference benchmark
Premium Igor Arsovski, now Nvidia's VP of hardware, presented the Groq 3 LPX rack's architecture and published the first third-party benchmark of the hardware.
Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card
Premium Heading into production during the tightest DRAM market in more than a decade.
OpenAI’s 700W Jalapeño ASIC outpaces 1,400W Nvidia flagship GPU
OpenAI arrived at Hot Chips on Tuesday with benchmarks claiming its first in-house chip beats Nvidia's GB300.
Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation
Premium Micron Fellow Raghu Sreeramaneni told the Hot Chips 2026 conference that the silicon penalty HBM carries against DDR5 is growing with every generation.
Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
Kyoto University builds transistor that survives 600C temperatures, compatible with standard fabs
A research team at Kyoto University has built a silicon carbide transistor that operates at 600°C (873 K) using ion implantation.
