3nm

Samsung expects major transistor density and performance gains from backside power delivery.

Intel's datacenter-oriented process technology meets critical defect density and performance targets, the company says.

EU seeks to double global chip production market share to 20% by 2030 with $47 billion subsidies to manufacturers.

Rapidus is looking for select global partners requiring leading-edge fabrication technologies, but it does not plan to become TSMC and serve hundreds of customers.

Japan's Rapidus estimates that leading-edge chips will cost 10 times more than today's mainstream chips made in Japan.

China-based MicroBT uses Samsung's 3 nm process technology for the Whatsminer M56S++ mining ASIC.

TSMC to dispatch more than 500 workers from Taiwan to install wafer fab tools at its fab in Arizona.

Samsung is on track for 2nm chips in 2025, 1.4nm in 2027.

As process technologies get more sophisticated, TSMC charges more for wafers.

Intel to get €10 billion subsidies from German government, plans expansion in Israel.