3nm
Latest about 3nm
Equipment delivery to Intel's Ohio fab delayed for several weeks
By Anton Shilov published
The transportation of Intel's oversized equipment to its Ohio fab is delayed to February 17.
TSMC is now the world's largest semiconductor maker by revenue, beating Intel and Samsung: Analyst
By Anton Shilov published
TSMC earned more than Intel and Samsung in 2023, becoming the world's biggest chipmaker by revenue.
Intel's Ohio fabs could reportedly slip to late 2026 — 'Silicon Heartland' factories were originally planned for 2025
By Anton Shilov published
Intel reportedly delays $20 billion Ohio fab project due to govt incentives and chip demand.
Samsung reportedly trials second-gen 3nm chip production
By Anton Shilov published
Samsung reportedly starts trial production on SF3 node, which contradicts the company's official SF3 status.
TSMC delays 3nm Arizona fab by a year, cites lack of U.S. subsidies
By Anton Shilov published
TSMC's Fab 21 Phase 2 deployment to be delayed to 2027 or 2028 due to demand and government subsidies.
Intel to reveal its roadmap beyond the 18A (1.8nm) process node in a few weeks
By Anton Shilov published
Intel vows to disclose its post-5N4Y roadmap at its IFS Direct Connect event in February.
Intel says 18A process node performance is ahead of TSMC's N2, but Intel's process arrives a year earlier
By Anton Shilov published
The chief executive of Intel believes the company's 18A process node is years ahead of TSMC's N2 due to backside power delivery.
Firm predicts it will cost $28 billion to build a 2nm fab and $30,000 per wafer
By Anton Shilov published
As wafer fab tools are getting more expensive, so do fabs and, ultimately, chips. A new report claims that
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