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OpenAI and Broadcom to co-develop 10GW of custom AI chips in yet another blockbuster AI partnership
By Luke James published
OpenAI has signed a multi-year deal with Broadcom to co-develop and deploy 10 gigawatts of custom AI accelerators and rack systems.

Applied Materials preps for the new 'Angstrom Era' in chipmaking
By Anton Shilov published
Applied Materials has introduced three new chipmaking systems that are set to mark the beginning of the 'angstrom' and 3D chiplent integration era in chipmaking.

Researchers achieve breakthrough integration of 2D materials on standard silicon chips
By Luke James published
Researchers at Fudan University have created a working memory chip just a few atoms thick, and the first to integrate 2D materials with standard silicon circuits.

Taiwan says its chip fabs are safe from China’s rare-earth crackdown
By Luke James published
Taiwan’s Ministry of Economic Affairs says the island’s chip sector will see 'no significant impact' from China’s newly expanded rare-earth export controls.

Trump strikes back at China with a 100% tariff and critical software ban
By Anton Shilov published
Hit them high.

China’s new rare-earth curbs target chipmaking industry in retaliation to US restrictions
By Luke James published
China has quietly extended its rare-earth export controls into the heart of the semiconductor supply chain.

Washington's ambition for a 50/50 semiconductor deal with Taiwan is missing a key component
By Anton Shilov published
Premium Is Lutnick's plan just political hogwash?

RISC-V set to announce 25% market penetration — open-standard ISA is ahead of schedule, securing fast-growing silicon footprint
By Sunny Grimm published
RISC-V International will announce that silicon on the ISA has reached 25% market penetration later this month. This outpaces projections set just last year by other research groups like Omdia.

Amkor breaks ground on Arizona advanced packaging campus, plugging critical gap in US semiconductor supply chain
By Luke James published
Amkor has broken ground on a new semiconductor packaging and test campus in Peoria, Arizona, marking a rare domestic expansion in one of the industry’s most critical and capacity-constrained areas.
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