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TSMC to start using High-NA EUV lithography in 2030
TSMC discloses plans to use High-NA EUV lithography in 2030, 6×12-inch photomasks with new scanners in 2033.
Belgian-Chinese semiconductor researcher arrested over alleged GaN trade-secret theft
Linked Chinese company was established months after the suspect joined BelGaN
Intel surpasses one million High-NA EUV wafers processed, outpaces the rest of the industry combined
Intel is leading the semiconductor industry with High-NA fleet and process-maturity milestone as it reaches 1 million wafers processed using High-NA tools, moves forward with 6×12 photomask effort.
TSMC fab equipment demand nearly doubles in six months
TSMC's equipment requirements have nearly doubled in just eight months as AI demand drives an unprecedented fab expansion, yet its 2026 CapEx budget has risen by only around 15%.
The current state of Hybrid Bonding in 2026
Premium Hybrid bonding, the copper-to-copper joining technique that replaces solder microbumps in 3D chip stacks, is in high-volume production on logic and freshly postponed on memory.
China's DUV technology 'at a similar stage to ASML in 2004,' analyst claims
Despite rumors, there is no evidence that Chinese makers of lithography tools can produce immersion lithography scanners in quantity.
Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor
Premium Samsung detailed a three-phase HBM roadmap at Hot Chips 2026 that progressively moves logic into the base die and ultimately stacks DRAM directly on the processor.
Motorless solid-state cooler uses heat to cool itself; could recycle processor heat into cooling
German and Japanese researchers demonstrate a heat-driven elastocaloric cooler that uses shape-memory alloys to turn waste heat into cooling.
Intel 14A defect density is dropping faster than the company expected
David Zinsner, chief financial officer of Intel, boasted at a conference
Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping
Premium Glass-core substrates, the replacement for organic chip packaging that Intel promised in September 2023, are now in final qualification but still not in a single commercial product