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China begins mass production of homegrown immersion chipmaking machines in major breakthrough, report claims
By Luke James Published
A state-backed company in Shanghai has begun mass-producing immersion deep ultraviolet lithography machines and is due to deliver the first units this year.

New semiconductor firm, TYLsemi, breaks cover, backed by $43 million in early-stage funding
By Anton Shilov Published
Premium TYLsemi is set to offer pre-validated chiplets, along with custom ASIC design services, and build highly custom multi-tile processors at relatively low costs.

Intel 4 gets its first foundry customer in Fortinet following firewall ASIC deal
By Luke James Published
Premium Intel will design, package, and fabricate Fortinet's sixth-generation Security Processor (SP6) on its Intel 4 node.

Intel to co-develop and manufacture Fortinet's next-gen firewall ASIC
By Luke James Published
SP6 will draw on what the companies described as Intel's expertise in disaggregated semiconductor design and advanced packaging.

TSMC eyes price hikes of up to 25% on chip production services in 2027, report claims
By Anton Shilov Published
TSMC reportedly intends to increase prices of wafers it processes citing demand, rising costs, and increased investments in new capacity.

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV
By Anton Shilov Published
SMIC's N+3 process technology can achieve transistor density comparable to TSMC's N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.

ASML's planned Low-NA EUV machine price hikes reportedly anger TSMC
By Anton Shilov Published
Premium Low-NA, high stakes

TSMC confirms significant yield and performance improvements in A14 update
By Anton Shilov Published
TSMC's A14 process technology progresses faster than N2 at this stage of development as developers of both client and AI/HPC plan to use it.

ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
By Anton Shilov Published
ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.

Tower Semiconductor revives shuttered Panasonic-era fab in $3 billion Japan photonics expansion — METI-backed plan targets $3.6 billion revenue by 2028
By Luke James Published
Premium Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan
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