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Washington's ambition for a 50/50 semiconductor deal with Taiwan is missing a key component
Premium Is Lutnick's plan just political hogwash?
New U.S. gov't rule says chipmakers have to make one chip in the US for each chip imported from another country to avoid 100% tariffs
The Trump administration is drafting a policy that would require chipmakers to match U.S. production with customer imports or face steep tariffs, potentially up to 100%.
Micron teams up with TSMC to deliver HBM4E, targeted for 2027
Premium Micron has confirmed it will partner with TSMC to manufacture the base logic die for its next-generation HBM4E memory, with production targeted for 2027.
NAND and DRAM prices surge by up to 20%
Contract prices for both NAND and DRAM have jumped by an estimated 15-20% in the fourth quarter of 2025, according to numbers published by DigiTimes on September 17.
Intel, Samsung, and SK hynix hit by another abrupt US policy change
They face a 120 day deadline
DDR4 production is expected to continue until 2026
News Analysis Major DRAM makers are phasing out DDR4 production from late 2025, as they shift to DDR5, but supply will remain available for niche applications for years to come.
Inside the future of 3D NAND: The roadmap to 500 layers
Premium The 3D NAND industry is rapidly advancing toward 500-layer stacks and 4800 MT/s interfaces by 2027, enabling denser, faster, and more efficient storage.
HBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
Premium We've compiled a full roadmap of HBM memory for SK hynix, Micron, and Samsung, including HBM3, HBM3E, HBM4, and HBM4E.
