Micron 9100 Max NVMe 2.4TB SSD Review

Early Verdict

The Micron 9100 Max sets the new benchmark for performance with its single-ASIC architecture. The 9100 easily overpowers more complex and costly designs, and significantly outperforms single-ASIC contenders. The 9100's blend of endurance and cost, along with the advantages of NVMe, assure its success.

Reasons to buy

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    Superior QoS metrics

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    Fastest SSD on the market

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    1 and 2 OIO performance with mixed workloads

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    Single ASIC design

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    Refined power/thermal envelopes

Reasons to avoid

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    Three year warranty (retail)

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    GUI needs work

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    QoS outliers with 50/50 read/write sequential mix

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    Low 1 and 2 OIO performance with random read/write workloads

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Micron 9100 Max Makes An Entrance

Micron, one of the largest NAND fab operators, announced its newest 9100 and 7100 Series high-performance enterprise SSDs at its Storage Business Unit day earlier this year. The company now has a well-rounded range of NVMe offerings that encompass the standard AIC (Add In Card), U.2 and M.2 form factors.

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Paul Alcorn
Editor-in-Chief

Paul Alcorn is the Editor-in-Chief for Tom's Hardware US. He also writes news and reviews on CPUs, storage, and enterprise hardware.

  • Flying-Q
    If the flash packages are producing so much heat that they need such a massive heatsink, why is there only one? Surely the flash on the rear of the card would need heatsinking too, even just a flat plate would suffice?
    Reply
  • Unolocogringo
    It appears the heatsink is more for the voltage converters and controller chip to me.
    Reply
  • Paul Alcorn
    18234127 said:
    If the flash packages are producing so much heat that they need such a massive heatsink, why is there only one? Surely the flash on the rear of the card would need heatsinking too, even just a flat plate would suffice?

    This is a standard configuration, though there are a few SSDs that have rear plates. Thermal pads were more common with larger lithography NAND, 20nm, 25nm, etc, because it generated more heat. New smaller NAND, such as the 16nm here, draws less power and generates less heat. In fact, it was very common with old client SSDs to have a thermal pad on the NAND, whereas now they are relatively rare. I think that they may be relying upon reducing the heat enough on one side to help wick heat from the other side, but the heatsink is primarily for the controller and DRAM with the latest SSDs. Also, it may just be convenient to add additional thermal pads to the NAND to keep the spacing for the HS even across the board.
    Reply